We provide extensive in-depth root cause analysis for  systems, board, device and die level failures.

Root cause analysis (RCA)

  • In depth, hands on, RCA programs.
  • Developing specialized testing methodologies
  • Scanning electron microscope imaging
  • X-RAY imaging
  • Thermal, shock
  • Vibration analysis.
  • Chemical contamination
  • Device and PCB cross sectioning
  • High altitude performance
  • Harsh chemical environmental performance.
  • Gas Chromatography
  • Mass Spectroscopy